This robust industrial embedded motherboard is engineered for high-performance automation and control applications, featuring a premium green FR-4 substrate and advanced multi-layer signal routing. Centered around a powerful FPGA/ASIC core, it integrates a comprehensive array of interfaces including D-SUB serial ports, audio jacks, and gold finger expansion slots, delivering exceptional computational power and expandability.
Designed for harsh industrial environments, the board incorporates precision power management circuits, high-quality passive components, and reinforced mounting posts to ensure stable operation under vibration and temperature fluctuations. The dense SMD component layout and impedance-controlled traces guarantee reliable signal integrity for high-speed data processing and communication, making it ideal for industrial control, machine vision, and embedded computing systems.
Compliant with IPC Class 2/3 and RoHS standards, this motherboard undergoes rigorous quality and environmental testing to ensure long-term reliability. It serves as a turnkey solution for reducing development time and accelerating time-to-market for advanced industrial automation products.
| Place of Origin | China (Mainland) |
| Brand Name | Customizable (OEM/ODM supported) |
| Model Number | IND-EMB-MB-001 (customizable) |
| Certification | ISO9001, RoHS, IPC Class 2/3, CE |
| Base Material | FR-4 Glass Epoxy (High Tg, anti-vibration grade) |
| Layers | 6-8 layers (high-speed signal design) |
| Board Thickness | 1.6mm / 2.0mm (customizable) |
| Surface Finish | ENIG / HASL (lead-free) |
| Solder Mask | Green (anti-oxidation, industrial grade) |
| Core Processor | High-performance FPGA/ASIC (customizable model) |
| Key Interfaces | D-SUB serial ports, audio jacks, gold finger expansion slots, mounting pos |
| Power Input | 12V/24V DC (industrial power supply compatible) |
| Operating Temperature | -40°C ~ +85°C (industrial grade) |
| Assembly Type | High-precision SMT + Through-Hole mixed assembly |
· Industrial automation & motion control systems
· Machine vision & image processing equipment
· Embedded industrial computing & data acquisition
· Aerospace & military embedded control systems
· Professional audio & industrial communication devices
1. High-Performance Core: FPGA/ASIC chip delivers parallel processing power for complex industrial algorithms.
2. Rich Interface Expansion: Multiple D-SUB ports and gold finger slots support seamless integration with peripherals.
3. Industrial Reliability: High Tg FR-4 material and reinforced mounting ensure stability in harsh environments.
4. Signal Integrity: Impedance-controlled traces minimize crosstalk for high-speed data transmission.
5. Turnkey Solution: Fully assembled design reduces hardware development time and simplifies system integration.
Q: Can the core FPGA/ASIC model be customized?
A: Yes, we offer full customization of core chip selection, interface configuration, and board form factor to meet specific project requirements.
Q: What is the maximum operating temperature of this motherboard?
A: The industrial-grade design supports a wide temperature range of -40°C to +85°C, suitable for extreme industrial environments.
Q: Does this board support custom firmware development?
A: Yes, we provide technical support for FPGA/ASIC firmware development, driver integration, and system software customization.
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